铜锡合金粉对树脂结合剂超硬制品力学性能影响的机理分析

Analysis on mechanism of influence of copper-tin alloy powder on mechanical properties of resin-bonded superhard products

本文突破在树脂超硬制品中加入Cu粉的传统思路,采用铜锡合金粉作为树脂结合剂的添加剂。通过抗弯强度、硬度、差热-热失重、扫描电子显微镜、能谱等分析方法,分别对采用Cu粉和铜锡合金粉作添加剂的树脂结合剂超硬制品的力学性能、热性能和微观结构作了对比分析,把二者对树脂超硬制品力学性能影响的机理进行了阐述。结果表明:在提高树脂超硬制品强度方面,Cu粉效果好于铜锡合金粉,但在提高树脂超硬制品硬度方面,Cu粉的效果差于铜锡合金粉;二者都提高了树脂结合剂的热分解温度;树脂对Cu粉的浸润包裹能力好于对铜锡合金粉的浸润包裹能力。

This research broke the traditional idea of adding copper powder to the resin-bonded superhard products, and took copper-tin alloy powder as an additive in the resin binder. By means of the bending strength, hardness, differential temperature analysis and temperature gravity （TG-DTA）, scanning electron microscopy （SEM） and other analysis methods, the mechanical properties, thermal properties and microstructure of the resin^bonded superhard products with copper powder and copper-tin alloy powder as additive were tested. The influence of copper powder and copper-tin alloy powder on the mechanical properties of the resin-bonded superhard products was compared, and the mechanism of the influence were analyzed. The results show that, in regard of improving the strength of the resin-bonded superhard products, the effect of copper powder is better than that of the the copper tin alloy powder. However, in regard of improving the hardness of the resin-bonded superhard products, the effect of the copper powder is worse than that of the copertin alloy powder. However, both copper powder and copper-tin alloy powder can improve the thermal decomposition temperature of the resin-bonded superhard products; The infiltration behavior of resin to Cu powder is better than that to the copper tin alloy powder.