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Investigation of silicon on insulator fabricated by two-step O^+ implantation

Investigation of silicon on insulator fabricated by two-step O^+ implantation
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摘要 In this paper,we investigated the dose window of forming a continuous buried oxide(BOX) layer by single implantation at the implantation energy of 200 keV. Then,an improved two-step implantation process with second implantation dose of 3×1015 cm-2 was developed to fabricate high quality separation by implanted oxygen(SIMOX) silicon on insulator(SOI) wafers. Compared with traditional single implantation,the implantation dose is reduced by 18.2%. In addition,the thickness and uniformity of the BOX layers were evaluated by spectroscopic ellipsometry. Defect-free top Si as well as atomic-scale sharp top Si/buried oxide interfaces were observed by transmission electron microscopy,indicating a high crystal quality and a perfect structure of the SOI fabricated by two step implantation. The top Si/BOX interface morphology of the SOI wafers fabricated by single or two-step implantation was also investigated by atomic force microscopy. In this paper, we investigated the dose window of forming a continuous buried oxide (BOX) layer by single implantation at the implantation energy of 200 keV. Then, an improved two-step implantation process with second implantation dose of 3×10^15 cm-2 was developed to fabricate high quality separation by implanted oxygen (SIMOX) silicon on insulator (SOI) wafers. Compared with traditional single implantation, the implantation dose is reduced by 18.2%. In addition, the thickness and uniformity of the BOX layers were evaluated by spectroscopic ellipsometry. Defect-free top Si as well as atomic-scale sharp top Si/buried oxide interfaces were observed by transmission electron microscopy, indicating a high crystal quality and a perfect structure of the SOI fabricated by two step implantation. The top Si/BOX interface morphology of the SOI wafers fabricated by single or two-step implantation was also investigated by atomic force microscopy.
出处 《Chinese Science Bulletin》 SCIE EI CAS 2011年第4期444-448,共5页
基金 supported by the National Science and Technology Major Projects of China (2009ZX02040) the National Basic Research Program of China (2010CB832906) the National Natural Science Foundation of China (60721004 and 61006088) Shanghai Foundation for Development of Science and Technology (08520740100) the Natural Science Foundation of Shanghai (10ZR1436100)
关键词 硅绝缘体 植入 电子显微镜观察 SOI晶片 制备 注入剂量 原子力显微镜 界面形态 silicon on insulator, interface morphology, dose window, separation by implanted oxygen
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