基于主动红外的倒装芯片缺陷检测研究

Research on Defect Inspection of Flip Chip Using Active Thermography

传统的倒装芯片无损检测技术并不能完全满足倒装焊检测需要,为此提出了一种基于主动红外的倒装芯片缺陷检测方法。通过非接触方式对倒装芯片施加热激励,并结合红外测温设备检测芯片温度分布情况,从而对芯片内部缺陷进行诊断与识别。实验研究表明,该方法能较好地检测出倒装焊点缺陷,可应用于倒装焊芯片的缺陷检测与诊断研究。

Traditional non-destructive detection methods owing to their disadvantages are insufficient for solder joint assessment. Therefore, a defect inspection method based on active thermography is proposed in this paper. In this approach, the flip chip is heated by non-contact thermal source. A commercial infrared thermal imager is employed to capture the thermal distribution on the chip. The thermal distribution and evolution indieafe defects inside flip-chip. Experimental investigation is carried out. The results prove that this method has ability of detecting defects inside flip-chip, and can be applied in defects inspection and diagnosis of flip-chip.