双热流法测定低温真空下固体界面的接触热阻

USING DOUBLE HEAT FLUX METER METHOD TO MEASURE THE THERMAL CONTACT RESISTANCE OF SOLID MATERIAL AT LOW TEMPERATURE AND VACUUM

本文介绍了低温真空下固体界面间的接触热阻机理， 重点介绍一种采用双热流计法既能精确测量圆柱型又能测量薄片型试样间接触热阻的装置， 该装置还能同时测量材料的热导率。同时， 文中给出一些材料在低温真空下的接触热阻值。

In this paper the mechanism of the thermal contact resistance of solid materials at low temperature and vacuum was introduced in brief.The experimental apparatus using double heat flux meter method to measure the thermal contact resistance between the rod shape or thin disk shape samples was also introduced mainly.At the same time,the apparatus can be used to measure the thermal conductivity of materials.Finally,the thermal contact resistance of some materials at low temperature and vacuum was proposed.