细菌修饰的碳糊电极表面超细微粒金膜的制备及应用

Preparation and Application of Gold_Film on the Surface of Bacterial_Modified Carbon Paste Electrode

本文提出一种采用电化学方法在巨大芽孢杆菌Ｄ０１修饰的碳糊电极表面制备超细微粒金膜的新方法，获得由平均粒径为８０ｎｍ金微粒组成的金膜．该方法操作简单，耗金量少，以此金膜作为工作电极检测水溶液中痕量铜具有良好的重现性和线性，检测灵敏度达０．０２ｎｇ／ｍＬ．该电极既可象金片电极多次反复被使用。

A novel method for preparation of gold_film composed of ultra_fine gold particles was reported in this paper. The gold_film was prepared by electrochemical method on the surface of the paste electrode modified with the strain Bacillus sp. D01 which has strong ability to absorb and reduce Au3+. In addition, this paper reported an experimental method of determining trace amount of Cu2+ in water solution using cathodic stripping analysis to estimate the performances of the obtained gold_film. The experimental results indicated that this new method for preparation of gold_film is simple. The obtained gold_film electrode is stable and sensitive to determining Cu2+.