摘要
利用四点探针和电子万能试验机分别测定了同种树脂体系中不同银粉形貌及银粉表面处理下导电胶的体积电阻率和剪切强度,探索了银粉含量、形状尺寸及表面处理对导电胶性能的影响规律。
The bulk resistivity and the shear strength of the electronic conductive adhesive adopted with the different morphology and surface treatment Ag fillers in the same resins was investigated using the Four point probe and the universal material testing machine.The effect of the size,morphology and surface treatment of Ag filler was discussed.
出处
《电子工艺技术》
2011年第2期72-75,共4页
Electronics Process Technology
关键词
导电胶
表面处理
体积电阻率
剪切强度
Electrically conductive adhesive
Surface treatment
Bulk resistivity
Shear strength
