碳纤维复合贴片的界面行为研究

Study on Interface Behavior of Carbon Fiber Composite Patch

采用低温等离子体法对碳纤维进行表面处理,并在微波固化条件下将碳纤维与环氧树脂复合成形,制得碳纤维复合贴片。采用X射线光电子能谱仪对碳纤维表面的元素组成进行了表征,采用扫描电镜和能量散射光谱(EDS)对碳纤维/树脂界面区的形貌和元素分布进行了表征。结果表明:碳纤维经处理后,其表面氨基官能团的含量增大,有利于纤维与树脂的化学键合;微波固化条件下,经表面处理的碳纤维/树脂界面相反应充分,Si富集在靠近碳纤维处,这是获得牢固粘结界面的根本原因。

The surface of carbon fiber was treated by low temperature plasma method. The carbon fiber composite patches were prepared using the fiber and epoxy resin at microwave curing condition. The contents of functional groups were characterized by X-ray photoelectron speetroscopy（XPS）. The morphology of interface of fiber and resin was characterized by scanning electronic mieroscopy（SEM） and the elemental composition was obtained by energy dispersive spectrum analysis（EDS）. The results show that the contents of amino group of treated carbon fiber are higher than untreated which can enhance chemistry bonding between fiber and resin. It can be concluded that complete reaction and the formation of Si peak is the basic reason of obtaining a firm interface at microwave curing condition.