钨铜箔片表面电沉积铝工艺的研究

Study on Processes of Aluminum Electro-deposition on Tungsten-copper Foil

利用AlCl3+LiAlH4-四氢呋喃-苯体系有机电镀液在自制W90Cu10箔片上镀铝,成功获得了高质量的镀铝层,分析了AlCl3与LiAlH4的配比、电流密度和电镀时间对镀层微观形貌、物相组成及厚度的影响,并得出了这3种影响因素的最佳取值。分析结果表明:铝镀层呈现锥状颗粒生长特征,表面颗粒排列紧密,镀液中AlCl3相对于LiAlH4的含量越少,电流密度越大,则表面颗粒越粗大;电镀时间越长,镀层颗粒在(220)方向择优生长越突出;可通过控制电流密度和电镀时间来控制铝镀层厚度,但若电流密度过高或电镀时间过长,镀层易出现裂纹、枝晶等缺陷。

Electrodepositing AI coatings on homemade W90Cu10 foils from AlCl3 ＋LiAlH4 non-aqueous solution was reported. Effects of variations in molar ratio of AlCl5/LiAlH4 , current density and plating time on surface morphology, phase composition and thickness of Al coatings were studied, and the optimal values of that three parameters were preliminarily gained. Results show that Al coatings display dense and cone-shaped micro-crystallites, and the particle size of aluminum coating increases obviously with increasing current density or decreasing the proportion of AlCl3 ; The longer electroplating time is, the stronger the preferred （220） crystallographic orientation is, and controlling the current density and plating time can achieve the purpose of controlling the coatings thickness, but excessive current density and plating time will lead to defects, such as cracks and dendrites on the edge of deposits.