基于PDMS的芯片电极多层互连系统的研究

Research on PDMS-based multi-layer interconnection system for chip and electrodes

本文提出了一种基于PDMS(聚二甲基硅氧烷)基底的芯片电极多层互连方法,应用MEMS(微电子机械系统)技术将芯片和电极进行了芯片级的互连,系统集成度高,尺寸小。相比传统的单层互连方法,在相同面积上互连电极数多。并且使用PDMS作为基底材料,大大降低了传统的以硅为基底的加工成本。制备的芯片电极多层互连系统芯片和电极互连数量多,各层绝缘层为绝缘性能良好的柔性Parylene(聚对亚苯基二甲基)薄膜,为柔性多层高密度线路互连技术提供了一种新方法。

A multi-layer interconnection system between chip and electrodes was proposed based on the PDMS as substrate.Then,the MEMS（micro-electro mechanial system） technology was applied to the interconnection between chip and electrodes at chip-level so as to make the system integrity higher with small size.Compared to the conventional single-layer interconnection system,the number of electrodes interconnected to a chip was increased in the same surface area.Moreover,the PDMS used as substrate could greatly reduce the processing costs in comparison to the silicon used as substrate,and the number of fabricated electrodes interconnected to the chip in such a way became greater.With the flexible parylene membrane used as the insulating barrier between different layers in the interconnection system,a new way for the flexible,multi-layer and circuit-intensive interconnection technology is provided.