用激光散斑法获取机床刀具应力场

Stress measurement of dynamic tool using speckle photography

本文应用激光散斑照相技术，测量了机床刀具的动态切削过程，并采用逐点分析和全场分析方法，分析了所拍摄的散斑图，得到了不同车速和不同切削用量条件下的应力场，并对测量结果进行了讨论。

Speckle photography is introduced in this paper.The dynamic tooling process of the planer tool is measured by means of speckle photography.The stress fileld in different cutting velocity and in different cutting output is gained.The experiment demonstrates that the speckle interferometry can be better used in dynamic measurement of planer tool. The results are discussed.