ABS塑料低温快速化学镀铜的研究

Study on electroless copper plating at low temperature and rapid rate for ABS plastic

提出了在碱性条件下，以甲醛为还原剂、酒石酸钾钠和 Ｅ Ｄ Ｔ Ａ 为络合剂、硝酸铅和碘化钾为稳定剂的适宜于 Ａ Ｂ Ｓ塑料表面化学镀铜的工艺条件。在该条件下施镀，镀速快、可镀厚铜、镀层光亮、镀液稳定，且由于施镀温度较低，极有利于在 Ａ Ｂ Ｓ表面施镀。

The new technique conditions for alkaline electroless copper plating on the surface of ABS plastic have been studied.Taking formaldehyde(37%) as reducing agent,sodium potassium tartrate and EDTA as complexing agent and lead nitrate and potassium iodide as stabilizer,the plating rate is rapid,the film is thick and bright and the solution of plating is steady.Because of lower plating temperature,this method is very advantageous to electroless copper plating for surface of ABS plastic.