回流焊的工艺特点及研究

Characterictics and Research of Reflow Soldering Technical Process

本文详细介绍了回流焊的特点,并对典型的回流焊工艺过程及参数进行了相关研究,分析了回流焊过程中的典型问题,具有很高实用价值。

This article describes the reflow soldering basic peculiarity,and research the reflow soldering technical process and Process parameters, analyses typical problem of the reflow soldering,with high practical valuation。