摘要
3-巯基-1-丙烷磺酸钠(MPS)、聚乙二醇(PEG)、Cl-(MPS-PEG-Cl)添加剂组合硫酸盐镀液常用于超大集成电路铜的超等角填充。采用极化曲线和电化学交流阻抗谱(EIS)研究了酸性硫酸铜镀液中MPS与PEG和Cl-于一定浓度组合下对Cu电沉积的影响。极化曲线和EIS结果一致表明,MPS与PEG和Cl-之间都存在协同作用,MPS-PEG阻化而MPS-Cl和MPS-PEG-Cl促进Cu的电沉积;低电位下,MPS和Cl-,Cu+/Cu2+形成的中间产物吸附于电极表面;MPS阻化Cu的电沉积,但与Cl-一起有协同作用,在超等角填充中起促进作用,大于阻化作用,这种促进作用源于MPS和Cl-的配位反应。
Effect of 3-mercapto-1-propane sulfonate(MPS) coupled with polypropylene glycol(PEG) and/or Cl-at different concentrations on copper electrodeposition in acidic copper sulfate bath was investigated by measuring polarization curves and electrochemical impedance spectra(EIS).Measurement results of polarization curves and EIS indicate that a synergistic effect exists between MPS and PEG or Cl-.MPS-PEG inhibited the electrodeposition of copper,while MPS-Cl and MPS-PEG-Cl accelerated copper electrodeposition.MPS could generate an intermediate via reaction with Cl-and Cu+/Cu2+ under a relatively low potential,and resultant intermediate was adsorbed on the surface of the electrode.MPS inhibited copper electrodeposition,but could coordinate with Cl-,contributing to the acceleration of superconformal filling of copper.
出处
《材料保护》
CAS
CSCD
北大核心
2011年第4期11-14,6,共4页
Materials Protection
基金
重庆市科委科技计划项目院士基金(CSTC
2008BC4003)资助
