摘要
针对设计的微机械陀螺开展了封装应力影响的研究。在对陀螺封装影响进行理论计算分析的基础上,进行了有限元仿真分析,并分析了温度变化引起的不同结构梁的谐振频率的变化,结果表明:在封装应力的影响下,陀螺的谐振频率与温度存在线性关系,不同梁结构的线性增减是不同的,基底材料和粘胶的热膨胀系数与杨氏模量是影响谐振频率变化的因素。
The effects of packaging stress on the micro-machined gyroscopes are studied.The packgaing effect on gyroscopes is analyzed theoretically.Finite element simulation analysis is carried out to find out the effect of basis and adhesive on the gyroscope.Simulation results show that packaging stress caused by temperature will change the resonant frequency of a gyroscope and difference structure beams have different changes.The coefficient of thermal expansion and Yong＇s modulus of adhesive and basis should be the factors to change resonant frequencies of a gyroscope.
出处
《传感器与微系统》
CSCD
北大核心
2011年第4期25-27,30,共4页
Transducer and Microsystem Technologies
关键词
陀螺
封装应力
有限元分析
谐振频率
温度
gyroscopes
packaging stress
finite element analysis
resonant frequency
temperature
