摘要
微摩擦热实验比较复杂,现有实验条件还难以对其进行较为深入的研究。采用有限元数值方法模拟硅材料微机电器件表面镀Si-DLC膜前后的弹塑性接触及摩擦热分布的性能。用Ansys10.0建立弹塑性接触和摩擦热分析的有限元几何模型,分析弹性阶段和弹塑性阶段各参数与接触性能之间的规律、摩擦热及热耦合应力的分布规律。研究结果表明:硅表面镀上一层Si-DLC膜后,其抵抗外力变形能力和抗磨性得到很大的提高,而且摩擦热引起的升温和热耦合应力大大降低。
Due to the complexity of the micro-friction heat experiments, the current experimental condition is insufficient for conducting a more in-depth study. The performances of elastic-plastic contact and distribution of friction heat of silicon MEMS devices before and after coated Si-DLC films was studied by finite element method. The geometric model of elasticplastic contact and friction heat analysis was built by Ansys10. 0, the law between the parameters and contact properties and the distributing rule of friction heat and thermal coupling stress at elastic and elastic-plastic stages was analyzed. The results show that, after the MEMS being coated with a layer of Si-DLC film, its resistance to external deformation and abrasion resistance are greatly improved, while the thermal coupling stress caused by friction heat reduces greatly.
出处
《润滑与密封》
CAS
CSCD
北大核心
2011年第4期37-43,共7页
Lubrication Engineering
基金
江苏技术师范学院启动基金项目(KYY10058)
江苏技术师范学院科技创新团队项目
关键词
有限元
Si—DLC膜
弹塑性接触
摩擦热
the finite element
Si-DLC films
elastic-plastic contact
friction heat