摘要
高密度印制电路板(PCB)设计中,地平面直接影响着整个电路性能和电磁兼容性能。该文基于3G无线终端电路实例,深入研究了高密度互连(HDI)PCB中的地平面设计,并提出了地平面的分割和缝合法,以及全屏蔽措施。采用该设计可以降低PCB中杂散电感引起的噪声,有助于降低信号间串扰、反射和电磁干扰。
During the high density interconnection printed circuit board design,the ground plane has a direct effect on the whole circuit performance and the electro magnetic compatibility.The ground plane design of HDI PCB has been studied based on the 3G wireless terminal circuit in this paper.The method of the ground plane splitting and sewing as well as the entire shield method have been proposed.The noise caused by the stray inductance in the PCB and the crosstalk,reflection as well as the electromagnetic interference can be reduced effectively by using the proposed design method.
出处
《压电与声光》
CAS
CSCD
北大核心
2011年第2期320-323,共4页
Piezoelectrics & Acoustooptics
基金
重庆市科技攻关资助项目"LTE TDD终端基带芯片平台关键技术的研究与应用"(CSTC
2009AB2088)
