基于ANSYS的Au-Al引线键合热可靠性研究

The Research of Thermal Reliability of Au-Al Wire Bonding based on ANSYS Software

采用ANSYS有限元分析软件建立Au-Al引线键合模型考察键合区在热循环加载下的应力应变情况;并采用Coffin-Manson方程计算了在热循环加载下焊点的疲劳寿命。结果表明:随着热加载循环次数的增加,模型的应力应变将增大;施加约束后,模型的应力将减小,引线键合的寿命延长。此方法可以比较各种不同情形下Au-Al引线键合热可靠性。

In this article,Au-Al wire bonding model was established based on ANSYS software to investigate the thermal stress and strain of wire bonding area under thermal cycling load,and thermal fatigue life of solder joint was calculated according to Coffin-Manson equations.The results show that both the stress and strain will be aggrandized with increase of thermal cycles;stress gets decreased and wire bonding life is extended by adding constraints.This method can be used to compare Au-Al wire bonding thermal reliability in different circumstances.