环氧模塑料的低应力化技术

Reduction of Internal Stress in Epoxy Molding Compounds

综述了降低环氧模塑料封装中由于热膨胀系数不匹配产生的内应力的三种主要途径,即加入填料、改变基体树脂的结构和引入弹性体。对低应力化作用的影响因素进行了讨论,并简要介绍了环氧模塑料的其它低应力化方法。

Three methods, including adding fillers, improving the structures of matrix resins and introducing elastomers, for reducing the internal stress of epoxy molding compounds for the encapsulating of large integrated circuits are reviewed. The internal stress is caused by mismatch of thermal expansion coefficients of different materials. Some influencing factors are presented.