化学机械抛光(CMP)技术

Chemical Mechanical Polishing Technique

介绍了半导体加工领域蓬勃发展的CMP技术。重点叙述了CMP技术的发展历程、采用的设备和消耗品、技术现状、新应用以及该技术主要使用的SiO_2CMP浆料的制备技术。

The CMP technique used in the field of semi - conductor fabrication was introduced. The introduction mainly focused on the recent progress in the CMP technique, the used equipment and consumables, the new application. the current situation of the CMP technique and the preparation technique of SiO2 Slurry used mainly in the CMP technique.