摘要
高可靠微电子封装的镀金液中铜离子是有害杂质，最高允许含量为 ２５ ｍ ｇ／Ｌ。用２，９－二甲基－４，７－二苯基－１，１０－邻菲罗啉（向红亚铜灵）作显色剂，采用ｐＨ 值为４ 的缓冲体系，在乙醇介质中，于４７５ ｎｍ 波长处对镀金液中的微量铜杂质直接进行分光光度测定。本法具有快速、简便等特点，且镀液中的其他成分对分析干扰小，适合现场使用。
A method is given for direct determination of trace copper in gold plating bath by using 2, 9\|Dimethy1\|4,7\|diphenyl\|1,10\|phenan\|throline (bathocupronic) as color reagent in this paper. Buffering solution is used to maintain pH to 4. And ethanol is chosen to be solvent. The transmittance is measured at 475 nm. This method is rapid and simple. other compositions in the gold plating solution do not interfere the determination. The method is suitable for the application in situ.
出处
《材料保护》
CAS
CSCD
北大核心
1999年第10期17-17,28,共2页
Materials Protection
