镍-钨合金电沉积层结构与显微硬度的研究

Structure and mircohardnees of Electrodeposited Ni-W Alloys

采用 Ｘ－射线衍射（ＸＲＤ）和 Ｘ－光电子能谱（ＸＰＳ）研究了镍－钨合金电沉积层的结构。结果表明，含钨量小于３７．２％ 的镍－钨合金电沉积层晶格为面心立方Ｆ，是固溶体结构和（１１１）择优取向，镍与钨均以金属单质形式存在于合金镀层中；含钨量小于４３．７％ 的镍－钨合金电沉积层属于金属化合物结构，其原子比为４∶１。显微硬度测定表明，具有金属化合物结构的镍－钨合金电沉积层的显微硬度最大。

The structure of Ni\|W alloy deposit wes studied by XRD and XPS. The XRD results showed that the Ni\|W alloy deposit is in the structure of FCC solid solution with (111) preferred orientation. The lattice constant and microhardness of Ni\|W alloy deposit increase as W content decreases. XPS results of Ni\|W alloy deposits indicate that the atomic ratio of Ni and W is 4∶1, so β\|Ni\|W alloy can be obtained by electrodeposition and its micro hardness is as high as 672.8 HV