摘要
通过理化检验和模拟试验对混合电路键合失效的原因进行了分析。结果表明:电路在生产和制造过程中,由于沾污和水气导致铝腐蚀。并针对故障现象和原因,阐述了铝腐蚀失效的机理,给出了控制电路沾污和水气的措施。
The bonding failure reason of hybrid circuit was analyzed by means of physical testing and chemical analysis and simulation experiment.The results showed that contamination and hydrosphere led to aluminum corrosion in production and manufacturing process of hybrid circuit.On the basis of the failure reason,the reasonable measures to control contamination and hydrosphere were put foward.
出处
《理化检验（物理分册）》
CAS
2011年第3期184-186,共3页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
关键词
混合电路
铝腐蚀
沾污
水气
hybrid circuit
aluminum corrosion
contamination
hydrosphere
