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一种中温固化环氧覆盖膜的制备

Preparation of a moderate temperature curing epoxy adhesive coverlay
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摘要 文章介绍了一种中温固化环氧胶粘剂,其特征在于选择两种混合环氧树脂为基体树脂,丁腈橡胶作为该胶粘剂的增韧剂,选用自制的对甲苯双胍作为环氧树脂固化剂。通过差式扫描热分析(DSC)分析表明,该胶粘剂能在1 30℃完全固化;热重分析仪(TG)分析显示该胶粘剂的固化物的性能有较好的耐热性和一定的阻燃性。将该胶粘剂用于覆盖膜中,储存期实验表明该环氧胶覆盖膜有较好的室温储存期;性能测试实验表明,该环氧胶覆盖膜有较好的综合性能,是一种有一定实用性的中温固化环氧覆盖膜。 In this paper,a moderate curing epoxy adhesive was prepared,characterized in that the choice of two hybrid epoxy matrix resin,nitrile rubber as the adhesive toughening agent,selection of homemade toluene biguanide as epoxy curing agent.By differential scanning calorimetry(DSC) analysis shows that the adhesive can be fully cured at 130℃;Thermogravimetric(TG) analysis shows that the performance of curing adhesive has good heat resistance and a certain degree of flame resistance;When the adhesive was used to coverlay,storage of experiment shows that the epoxy adhesive coverlay has a good shelf life at room temperature;Performance tests show that the epoxy adhesive coverlay has good general performance,is a certain practical moderate temperature curing epoxy coverlay.
出处 《印制电路信息》 2011年第4期5-8,共4页 Printed Circuit Information
关键词 中温固化 环氧胶粘剂 覆盖膜 moderate temperature curing epoxy adhesive coverlay
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参考文献3

  • 1林金堵,龚永林.现代印制电路基础[M].中国:印制电路行业协会,2001.
  • 2范和平,李桢林.一种挠性印制电路板包封膜用中温固化环氧胶粘剂及其制备方法[P].CN101845287,2010.
  • 3黄堂杰.一种用于生产软性印刷电路板覆盖膜的粘合剂及其制备方法[P].CN1405260,2003.

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