电镀铜铜面对后制程的影响

Research of the influence to post-process by copper-plating surface

随着PCB产品的发展趋势不断朝向高精密化、轻薄化及环保化,PCB行业内亦不断推出新工艺、新材料的制造方法,工艺流程也越来越复杂,前后制程之间的相互作用也日趋明显。针对电镀铜面对后制程的影响研究展开分析。众所周知,由于电镀过程中存在断电流或不连续电镀(比如电镀过程中存在两个及以上的电镀铜缸)或基铜和电镀铜或全板电镀铜和图形电镀铜之间在横切片微蚀后铜层和铜层之间存在分界线情况,后工序棕化处理时若刚好在此镀层分界线处,则会产生棕化面棕化不良的影响。同时图形电镀铜面的表观问题引起的阻焊油墨孔口发白或镍金粗糙表观问题。

Along with the production of PCB which develops to more precise,light-thin and environmental protection,the PCB industry also present the manufacture technique of new techniques and new material immediately,technological flow is more and more complicated,and the interplay of pre-process and post-process is more and more osculation.This paper discourses about research of the influence to post-process by copper-plating surface.As we all know,it is occurred that the electric current is cut abruptly or it is constantly plated（for example, it have more than two copper tank for panel plating.） or it is between copper-fool and plating or it is between panel plating and pattern plating,it has boundary after the micro-etch of transverse section between copper-plating and copper-plating;we research the impact of the boundary in allusion to the brown oxid.At one time,we research the exceptional copper-plating surface which brings on the chromatism on the edge of hole in solder mask process or the coarseness on the gold surface.