≥60μm厚孔铜产品制作工艺研究

Study on the technology of thick hole copper≥60μm

文章主要针对一种厚孔铜(≥60μm)产品的制作工艺进行研究,如何在将孔铜控制至≥60μm以上,而电镀面铜能有效控制在60μm以下,并进行顺利制作出精细线路。本次主要采用了全板加成、局部加成、全板加成+局部加成三种工艺分别进行试验测试评估,最终采用全板加成+局部加成相结合的工艺方法最佳,产品质量及可靠性均符合产品要求。

This article is mainly aiming at researching on the production artwork of thick hole copper（ copper thickness≥60μm） that how to both control the thickness of the hole over 60μm and can efficiently control the thickness of plating copper under 60μm to effectively produce high precise line.We apply three technologies in this test：Whole panel addition,Partial panel addition and whole and partial panel addition.Finally,we conclude that the Addition（Whole and Partial panel） is the best technology with reliable.