高层盲埋孔厚铜板制作探讨

Discussion on production of high-level thick copper blind and buried vias board

随着电子科技的不断发展,高层厚铜线路板应运而生。文章从高层厚铜板的制作设计、工艺流程、制作要点等进行经验总结,为生产设计提供数据支持。

Along with the unceasing development of electronic technology,the high multi-layer thick copper PCB arises at the historial moment.It will be empirically summarized in this article from the high multi-layer thick copper PCB＇s manufacture design,the technical process,the manufacture main points and so on to provide the data support for the production and design.