埋置电容PCB工艺的开发和量产

Development and mass production of embedded-capacitance PCB process

根据客户埋置电容PCB量产需求,开发了A与B两种埋容材料的埋置电容工艺,分别为A单面蚀刻工艺与B双面蚀刻工艺。针对客户特殊设计的特殊要求,成功开发了0.1 mm激光通孔埋容板工艺。根据两种埋容材料的不同工艺,进行了理论研究和批量生产,重点研究了翘曲、板损、埋容精度控制、误差控制等问题,设计了埋容板插板架来解决阻焊油墨制作问题并推广。进行上述研究的同时,总结出适合我司的埋容工艺,形成埋容板生产控制文件,实现公司埋容板从试板向量产的飞跃,为公司提供了新的利润增长点。

To meet the need of mass production of embedded-capacitance PCB,two kinds of processes, including of A material single sided etched process and B double sided etched process,were developed in SME.Being directed against the special requirement of customer,the new process of embedded-capacitance PCB with 0.1mm Laser through hole was exploited.According to the different processes of A and B materials,process theory and mass product were researched.Some problems such as bow and twist,board damage,Embedded-Capacitance precision control and error control were mainly researched.In addition,the flashboard frame was designed for solder mask of Embedded-Capacitance PCB.As the same time,the proper Embedded-Capacitance method for our company and established rules of production control were established,the item was realized successfully from sample to mass production.