摘要
随着PCB行业发展步入系统封装(SOP)阶段,PCB无源器件隐埋技术也成当今研究的热点。我司的埋铜技术的研究已经较成熟,但是对于磁芯的埋入还没涉及过,而目前电源部分电感大都需要手工贴装,工作效率低,存在焊接焊点不良等风险,不利于产品设计小型、高密化,所以对在PCB中埋入磁芯的研究很有必要。在文章中,我们得出磁芯埋入的控制方法,使产品能够满足客户对电感的要求。
The PCB is developed to the SOP level,and the technology of passive element buried in PCB is becoming the hot of the research at present.The technology of burring copper in the PCB is mature in our company, but there is no research of burring magnetic in the PCB.At present,the most of power inductance is mounted by hands.In this method,there is a risk of bad welding,and is not good at product design of smaller,high density,so there is necessary to study the magnetic burring in the PCB.By the article,we get the control method of burring magnetic product,and satisfy the inductance require of the customs.
出处
《印制电路信息》
2011年第4期166-174,共9页
Printed Circuit Information
关键词
埋磁芯
电感
厚孔铜
槽孔
Buried magnetic
Inductance
Thick hole copper
Cavity