新型印制电路板叠通孔设计及其制造方法

New stack of through-hole printed circuit board design and manufacturing methods

目前伴随现代电子产品向"轻、薄、小、多功能化"发展,电子器件的高集成化,互连技术从通孔插件(THT)向表面安装(SMT)和芯片安装(CMT)技术发展,加速了高密度(HDI)印制电路技术开发。高密度印制电路加工技术,成为当今印制电路行业的一个热门话题。目前PCB通孔结构有如下两种:VOI(Via on IVH)结构在层间通孔(IVH)上布设通孔(Via),即在IVH的引出线上布设VIA,呈螺旋形通孔(SprialVia)结构,或直接在IVA上布设通孔。VOV(Viaon Via)结构直接在VIA上布设Via,呈现叠加形状。现通过研究开发新型PCB叠通孔互连方式HIH(Hole In Hole)结构,将更有利于高密度布线设计。论文涉及一种新的印制电路板叠孔布线设计方法,更确切说是印制板埋孔中增加过孔的设计及制造方法。

With modern electronic products to the current＂light,thin,small,multi-functional＂of the development of highly integrated electronic devices,interconnect technology from the plug-hole（THT） to surface mount（SMT） and chip installed（CMT） technology development Accelerate the high-density（HDI） printed circuit technology development.High-density printed circuit processing technology becomes a hot topic.PCB throughhole structure currently has the following two：VOI（VIA on IVH） structure in the layer through-hole（IVH） on the through-hole layout（VIA）,which laid in the IVH＇s Lead on VIA,spiral-shaped hole（Sprial VIA） structure,or laid directly on the hole in the IVA.VOV（VIA on VIA） on the structure laid directly on the VIA,showing superimposed shapes is introduced. Now through research and development of new PCB through-hole interconnect stack of HIH（Hole in Hole） structure,it will be more conducive to high-density wiring design.This paper deals with a new stack of printed circuit board layout design hole,more precisely,is buried in holes in the increase in PCB through-hole design and manufacturing methods.