高密度PCB设计给阻焊曝光带来的挑战——新设计和新设备的研究与应用

The challenge caused by PCB high density design to solder mask exposure——the study and application for new design and new equipment

随着PCB向着高密集线和高精细度的方向发展,高密度设计的生产板也越来越来越多,这就给阻焊工序的生产尤其是阻焊对位曝光工段的生产带来了很大的挑战,现通过优化工具设计、规范工具管控、引入新功能设备、与设备商开发新设备来解决高密度板在阻焊工序所遇到的挑战,最终成功实现了量产应用。

The product of high density design become more and more popular along with the fast development that run to more fine line and high registration parameter.These products with high density design bring very serious impact to solder mask process,especially the exposure workshop section.Now we will continue to resolve these challenges by optimizing the tooling design,correcting the control for tooling,buying the machine with new function, developing the new machine with supplier.The research results have been successfully applied on batch production.