高解像度双面印刷电路板的穿通孔法制造工艺

Technique to make high-density double side printed circuit board the method of punching through board

该文介绍采用PER—800液体感光抗蚀(镀)剂和PSR—550液体感光阻焊剂,生产制造具有高解像度的双面印刷电路板(PCB)的“穿通孔法”工艺技术;同时研究分析PER—800和PSR—550的使用方法和技术特性。

Of this research, the main aim is to find the method of punching through board, which is technique to make high - density double side printed circuit board with PER - 800 and PSR - 550. PER - 800 is alkali - develop type photo imaginable plate- resist. PSR - 550 is alkali - develop type photo imaginable solder resist. The usage and technical feature of PER - 800 and PSR - 550 have been studied.