金属互连焊球的电迁移试验设计研究与灵敏度分析

DESIGN OF EXPERIMENTS AND SENSITIVITY ANALYSIS FOR ELECTROMIGRATION ON SOLDER JOINTS

综合考虑多种电迁移驱动机制,基于ANSYS软件和FORTRAN程序提出电迁移失效算法,导出了电迁移灵敏度分析方程,并建立相应的数值算法.在此基础上考虑设计变量为激活能、初始自扩散系数和材料力学性能参数等对金属互连焊球进行电迁移灵敏度分析,同时基于三维有限元分析的全因子试验设计法对CSP封装结构的电迁移寿命进行仿真预测.

This paper presents a algorithm for electromigration（EM） failure analysis based on ANSYS multi-physics commercial software and FORTRAN codes with considering multiple driving migration mechanisms.The electromigration sensitivity analysis equation and the corresponding numerical algorithm are also proposed.The sensitivity analysis for solder joints is implemented when the involved EM sensitivity design variables are the activation energy,the initial self-diffusion coefficient and mechanical properties of the material parameters.Furthermore,the EM simulation for CSP structurs performed to get failure lifetime based on the full factorial design of experiments（DOE） by using 3D finite element analysis.