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高频异质结晶体管直流和交流模型及其验证 被引量:1

DC-AC Models and Verification of High-Frequency HBT
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摘要 针对漂移扩散方程和能量平衡方程的解建立了SiGe HBT的直流和交流理论模型,综合考虑了速度饱和效应、基区和发射区的禁带变窄效应和复合效应,并与台面型SiGe HBT实验结果进行了比较,截止频率为10.5 GHz,电流增益为45,与理论结果基本符合。 Based on drift-diffusion equation and energy balance equation,a SiGe HBT DC and AC model was established.In addition,the velocity saturation effect,base and mitter bandgap narrowing effect and the recombination effect are included.Finally,the theory and mesa-type SiGe HBT experiment results were compared,the cut-frequency is 10.5 GHz,the current gain is about 45,the theoretical results are consistent with experiment results.
作者 高金明 李垚
出处 《电子器件》 CAS 2011年第2期132-136,共5页 Chinese Journal of Electron Devices
基金 安徽省自然科学基金项目(090412029)
关键词 SIGE HBT 漂移扩散模型 波尔兹曼模型 电子温度 复合效应 速度饱和效应 SiGe HBT DDM(Drift Diffusion Mode) BTM(Boltzmann Model) electron temperature recombination effect velocity saturation effect
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参考文献15

  • 1Banerjeeb, Venkataramans, Lu Y. Cryogenic Operation of Third- Genenration,200 GHz Peak fT, Silicon-Germanium Heterojunction Bipor Transistors[ J]. IEEE TED,2005,52(4) :585-593.
  • 2施敏.半导体器件物理(中文第三版)[M].西安:西安交大出版社,2005:191.
  • 3Lu T C, Chert H P, Kuo J B. SiGe Heterojunction Bipor Transistors: an Analytical Current Gain and Forward Transit Time Model [ J ]. Solid-State Electronics, 1993,36(9) : 1313-1320.
  • 4Eberherdt J,Kasper E. Bandgap Narrowing in Strained SiGe on the Basis of Electrical Measurements on Si/SiGe/Si Hetero Bipolor Transistors[ J ]. Materials Science and Engineering,2002,B89:93-96.
  • 5J.Chen,李栓庆.Si/Si_(1-x)Ge_x异质结双极晶体管和Si双极晶体管高频性能的比较分析[J].半导体情报,1993,30(2):30-38. 被引量:1
  • 6Peter. Ashbum, SiGe Heterojunction Bipolor Transistors [ M ]. NewYork, John Wiley & Sons,2003:255.
  • 7施敏,伍国珏.半导体器件物理(中文第三版)[M].耿莉,张瑞智译.西安:西安交大出版社,2005:199.
  • 8Lu T C, Chen H P, Kuo J B. SiGe Heterojunction Bipor Transistors: an Analytical Current Gain and Forward Transit Time Modd[ J ]. Solid-State Electronics, 1993,36(9 ) : 1313-1320.
  • 9Jochen Eberhardt, Erich Kasper. Modelling of SiGe Heterobipolar Transistors:200 GHz Frequencies with Sytmmetrical Delay Times [ J ]. Solid-State Electronics,2001,45 (2001) :2097-2100.
  • 10Hong G B,Fossum J G. Implementation of Nonlocal Model for Impactionization Current in Bipolar Circuit Simulation and Application to SiGe HBT Design Optimization [ J ]. IEEE Trans Elec Dev, 1995,42 (6) : 1166-1173.

二级参考文献16

  • 1李垚,刘嵘侃,傅湘宁,徐婉静.按比例缩小SiGe HBT能量传输模型[J].中国科学技术大学学报,2005,35(5):595-600. 被引量:2
  • 2Li Y, Kong D-Y, Zhen J, et al. A base transport model for ultra-thin-base SiGe HBT [J]. Int J Electronics. 2000, 87 (11): 1281-1287.
  • 3Kuo J B, Huang H J, Lu T C. Closed-form physical model for VLSI bipolar devices considering energy transport [J]. IEE Elec Lett, 1994, 30(3): 268-269.
  • 4Liu R, Qian W, Wei T. Analytical modeling of current gain and frequency characteristics under high injection levels in Si/SiGe heterojunction bipolar transistors at 77 K and 300 K [J]. Microelec J, 1999, 30(12):1195-1205.
  • 5Kwok K H. Analytical expression of base transit time for SiGe HBTs with retrograde base profiles [J]. Sol Sta Electro, 1999, 43(2): 275-283.
  • 6Chang S T, Liu C W, Lu S C. Base transit time of graded-base Si/SiGe HBTs considering recombination lifetime and velocity saturation [J]. Sol Sta Electro,2004, 48 (2): 207-215.
  • 7Patri V S, Kumar M J. Profile design considerations for minimizing base transit time in SiGe HBT's [J].IEEE Trans Elec Dev, 1998, 45(8):1725-1731.
  • 8Kwok K H, Selvakumar C R. Profile design considerations for minimizing base transit time in SiGe HBTs for all levels of injection before onset of Kirk effect[J]. IEEE Trans Elec Dev, 2001, 48(8): 1540-1549.
  • 9Hong G-B, Fossum J G. Implementation of nonlocal model for impact-ionization current in bipolar circuit simulation and application to SiGe HBT design optimization [J]. IEEE Trans Elec Dev, 1995, 42(6): 1166-1173.
  • 10Wu H-C, Kuo J B. A compact velocity-overshoot model for deep-submicron bipolar devices considering energy transport [J]. IEEE Trans Elec Dev, 1995,45(2) : 417-422.

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同被引文献8

  • 1滕晓云,刘彩池,郝秋艳,赵丽伟,张帷.Si衬底GaN基材料及器件的研究[J].半导体技术,2006,31(2):98-101. 被引量:3
  • 2施敏,伍国钰.半导体器件物理[M].西安:西安交通大学出版社.2010.
  • 3Apanovich Y. Numerical Simulation of Submicrometer Devices, Including Coupled Non-Local Transport and Non-Isothermal Effects [ J ]. IEEE Trans. Electron Devices, 1995,42 (5) :890-898.
  • 4Klaassen D B M. A Unified Mobility Model for Device Simulation [ J ]. Solid-State Electronics, 1992,35:953-959.
  • 5Canali C G,Magni R Minder,Ottaviani G. Electron and Hole Drift Velocity Measurements in Silicon and Their Empirical Relation to Electric Field and Tempratrue [ J ]. IEEE Trans. Electron Devices ED, 1975,22 : 1045-1047.
  • 6Law M E. Self-Consistent Model of Minority-Carrier Lifetime, Diffusion Length, and Moblity [ J]. IEEE Electron Device Letters, 1991,12(8) :256-261.
  • 7李炜,陈俊芳,王腾,张洪宾,郭超峰.Si表面吸附GaN的第一性原理研究[J].材料导报,2009,23(16):71-73. 被引量:3
  • 8陈鹏,沈波,周玉刚,陈志忠,臧岚.Si基GaN外延生长[J].固体电子学研究与进展,1999,19(2):199-202. 被引量:5

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