期刊文献+

电沉积工艺参数对铁-钴合金箔组成与结构的影响

Effects of electrodeposition conditions on composition and structure of iron-cobalt alloy foils
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摘要 研究了电流密度、温度和pH等工艺条件对钛板上电镀Fe-Co合金箔组成、阴极电流效率、表面形貌和微观结构的影响。电解液配方为:FeSO4·7H2O40g/L,CoSO4·7H2O30g/L,CoCl2·6H2O10g/L,硼酸30g/L,柠檬酸三钠40g/L,抗坏血酸10g/L,糖精1g/L,十二烷基硫酸钠0.1g/L。最佳工艺条件为:电流密度4A/dm2,温度50°C,pH1.5。Fe-Co合金箔为铁钴置换固溶体和面心立方晶体结构,表现出强烈的(111)织构择优取向,结构致密,晶粒细小、均匀,并由尺寸更小的亚晶粒紧密团聚组成。合金箔表面平整,无裂纹和孔洞。 The effects of process conditions such as current density,temperature and pH on the composition,cathodic current efficiency,surface morphology and microstructure were studied for Fe-Co alloy foil electroplated on Ti sheet.The bath formulation is as follows:FeSO4·7H2O 40 g/L,CoSO4·7H2O 30 g/L,CoCl2·6H2O 10 g/L,boric acid 30 g/L,trisodium citrate 40 g/L,ascorbic acid 10 g/L,saccharin 1 g/L and sodium dodecyl sulfate 0.1 g/L.The optimal conditions are temperature 50 °C,pH 1.5,and current density 4 A/dm2.The Fe-Co alloy foils are Fe-Co substituted solid solution and face-centered cubic structure with a preferential (111) orientation.The Fe-Co alloy foils have the features of smooth surface,no crack and cavity,compact structure,fine and uniform grain.In addition,the foils are compared of agglomerated small sub-grain.
出处 《电镀与涂饰》 CAS CSCD 北大核心 2011年第4期1-4,共4页 Electroplating & Finishing
基金 国家自然科学基金资助项目(50873037) 湖南省科技厅计划项目(2009GK3117)
关键词 铁-钴合金 电沉积 电流效率 晶体结构 表面形貌 iron-cobalt alloy electrodeposition current efficiency crystal structure surface morphology
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  • 1O’HandleyRC.现代磁性材料原理和应用[M].北京:化学工业出版社.2002.426.
  • 2KOZA J A, KARNBACH F, UHLEMANN M, et al. Electrocrystallisation of Co-Fe alloys under the influence of external homogeneous magnetic fields~Properties of deposited thin films [J]. Electrochimica Acta, 2010, 55 (3): 819-831.
  • 3CHOI J-H, YIM T-H, KANG T, et al. Apparatus and method for manufacturing Ni-Fe alloy thin foil: US, 6428672 [P]. 2002084)6.
  • 4刘天成,卢志超,李德仁,卢燕平,孙克,周少雄.电沉积Ni-20%Fe(质量)磁性合金箔工艺的研究[J].金属功能材料,2007,14(4):1-5. 被引量:1
  • 5姜力强,郑精武,陈巧玲.电沉积软磁铁箔连续化生产的关键技术研究[J].稀有金属,2005,29(3):293-296. 被引量:4
  • 6TOMIOKA Y, YUKI N. Bend stiffness of copper and copper alloy foils [.1]. Journal of Materials Processing Technology, 2004, 146 (2): 228-233.
  • 7GRANDE W C, TALBOT J B. Electrodeposition of thin films of nickel-iron: I, Experimental [J]. Journal of the Electrochemical Society, 1993, 140 (3): 669-674.
  • 8MYUNG N V, NOBE K. Electrodeposited iron group thin-film alloys: Structure-property relationships [J]. Journal of the Electrochemical Society, 2001, 148 (3): C136-C144.
  • 9ZHANG Y H, IVEY D G, Characterization of Co-Fe and Co-Fe-Ni soft magnetic films eleetrodeposited from citrate-stabilized sulfate baths [J]. Materials Science and Engineering: B, 2007, 140 ( 1/2): 15-22.

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