摘要
在LTCC基板加工中,生瓷预烘干、图形印刷后烘干可能会产生中心位置塌陷、破损、翘曲等形变问题。而LTCC是通过加工多层生瓷、按一定顺序准确对准,再层压、切割后共烧而成,为满足产品平整度及位置对准精度要求,我们必须解决各层烘干过程中存在的形变问题,保证每一层生瓷加工质量。文章介绍了LTCC基板制造过程中带框生瓷烘干的工艺方法,并通过工艺试验对当前所用两种烘干设备的工艺参数进行比较,有效改进了烘干后生瓷表面的质量。同时,我们结合不同产品进行试验,对烘箱和带框架烘干组件完成烘干原理及特点进行了分析,阐述了两种烘干工艺加工特点和工艺优化过程。
During LTCC production,green-tape pre-curing,after-print curing and other critical processes,green tape distortion problems might happen,such as center concavity,splits,warpage.While LTCC is achieved through precise alignment of green tape layers,and lamination,green-cut and co-fire processes followed;it is necessary to assure the processing quality of each layer.To achieve optimum surficial finish positional registration accuracy,the paper focused on a introduction of frame-mounted LTCC green-tape curing methods,and it also compared various processing parameters of 2 curing equipments involved.Moreover,based on different products and tests,the frame-mounted curing oven and curing module working principles were analyzed,as well as their processing characteristics and optimization courses.
出处
《电子与封装》
2011年第4期6-11,共6页
Electronics & Packaging
