引线键合中第一点勾线力的影响因素

Affecting Factors of Wire Pull Force in Wire Bonding

勾线拉力测试是评估引线键合质量的一种主要方法,同时影响测试结果的因素有很多。文章通过理论分析和实际测量,发现封装结构、线弧高度和勾线位置对第一焊点的勾线力有显著影响。Non-EP结构中线弧的第一点勾线力比EP结构中的大;随着线弧高度的增加,线弧的第一点勾线力将逐渐变大;在勾线位置由第一焊点逐渐移至线弧中间位置时,一般高度线弧的第一点勾线力将会降低,但高度很高的线弧第一点勾线力反而会升高。

Bond pull test was an important method to evaluate the quality of wire bonding while there were many factors affecting the result.Based on both theoretic analysis and actual test,we found that packaging structure,loop height and test location affected the wire pull force.The wire pull force in Non-EP structure was higher than that in EP structure;and the wire pull force increased when loop height increased;during test location moving from the ball bond to the center of loop,the wire pull force in normal loops decreased while that in very high loops increased.