摘要
文章介绍了一种Ku波段600W固态合成功率放大器的工程实现。根据工程应用的实际要求,该固态功率放大器采用多芯片多级合成,每级功率合成采用了不同的合成方式。其中芯片级合成选择了微带合成方式,模块级合成选择了多腔体空间耦合合成结构,组件级合成选择了波导合成方式。固放以6.5W的MMIC功放单片为基本单元,共采用了128个功放单片合成出大于600W的脉冲峰值功率,功率附加效率高达18.5%,并具有脉冲速度快、频谱纯净、体积小、可靠性高、工程上容易实现等优点。
This paper shows an engineering application of a 600W Ku-band SSPA（Solid-State Power Amplifier）.Multi-chips combining technique was used in this SSPA.To meet the engineering request of the product,different combining structures were used on different levels.The 6.5W MMIC amplifier was the core of the SSPA,and 600W peak power was got by 128 chips combined with the PAE of 18.5%.It also has the characteristic of speedy pulse,pure spectrum and small size.
出处
《电子与封装》
2011年第4期24-27,38,共5页
Electronics & Packaging
