摘要
散热是制约大功率LED照明灯推广应用的关键技术问题。本文通过对LED照明灯散热的影响因素及设计要素的分析,研制了4种不同散热结构的大功率LED照明灯,并且做了温度测试和有限元数值模拟分析。结果表明,LED结温受散热片和基板的连接方式、散热片和电源的排布以及散热的总表面积等因素影响。
Radiation is the key technology of the promotion and application of high-power LED lights.Based on the influencing factors of radiation and the analysis of the design considerations,this paper has developed four kinds of high-power LED lights with different radiation-structure,and has made the temperature test and the finite element analysis and simulation.The results indicated that LED junction temperature is related to several factors,such as the connection of heat sink and MCPCB,the distribution of heat sink and power,the total surface area of radiation,and so on.
出处
《新技术新工艺》
2011年第3期1-3,共3页
New Technology & New Process
关键词
大功率LED照明灯
散热装置
散热要素
数值仿真
结温
High-power LED lights
Radiation device
Radiation factors
Digital simulation
Junction temperature
