摘要
随着单个芯片上集成的处理器的个数越来越多,传统的电互连网络已经无法满足对互连网络性能的需求,需要一种新的互连方式,因此光互连网络技术应运而生。目前,电互连的片上网络在功耗、性能、带宽、延迟等方面遇到了瓶颈,而光互连作为一种新的互连方式引用到片上网络具有低损耗、高吞吐率、低延迟等无可比拟的优势。本文主要探讨了片上光网络的研究趋势和发展方向,并对目前主要对基于总线结构和Torus结构的片上光网络进行了分析和比较,主要集中在拓扑结构、路由算法以及流控机制等方面。本文最后对片上光网络与3D技术结合以及全光片上互连网络的未来发展前景进行了探讨。
As the number of processing cores that are integrated into a chip multiprocessors(CMP) continues to grow,the traditional electric interconnection cannot meet the demands on interconnection networks.Therefore,the technology of optical interconnection is brought forward.At present,the electrical interconnection network on-chip encounters a bottleneck in power,performance,bandwidth and latency,and optical interconnect is introduced into network on-chip as a new way of interconnection,which has incomparable advantages for low power dissipation,high throughput and low latency.This paper introduces the evolution of optical networks on chip,and compares the bus-based architecture to torus networks and analyses the topological configuration,routing algorithms and flow control of Optical Network-on-Chip(ONoC).Finally,the prospect of the combination of the optical network on-chip and 3D technology,and all optical network on-chip are also discussed.
出处
《计算机工程与科学》
CSCD
北大核心
2011年第4期56-61,共6页
Computer Engineering & Science