硅芯片封装中改善芯片崩裂的划片工艺

Improvement of Dicing Process of Silicon Chip for Precaution Against its Disintegration in Package

对崩裂产生的原因及其机理进行分析,确定划片站发生崩裂的根本原因,并针对老型号的切割刀无法适用于新的窄切割槽产品的问题,研究并分析了一种新型切割刀.通过对比实验,确定此新型切割刀在切割新产品时所需要的参数,以最终减少崩裂现象的发生.

The paper analyses the reason and mechanism of disintegration of silicon chips.It is ascertained that the dicing process is responsible for disintegration as the old model of dicing blade is not fit for new products with narrow kerf.Thus a new type of blade is proposed.Comparative experiment gets the correct parameter for the new blade dicing new products,which eventually reduces disintegration.