摘要
低铅含量的光亮Ｓｎ－Ｐｂ合金镀层不仅可避免晶须及锡的晶型转变现象，而且具有耐高温，低污染特性，因而具有较好的应用价值。研究了以柠檬酸和ＥＤＴＡ为络合剂的低铅光亮Ｓｎ－Ｐｂ合金电镀工艺。探讨了主盐浓度、络合剂浓度、温度及电流密度对镀层中Ｐｂ含量的影响。
Electroplating technology of SnPb alloy in citric acidEDTA system was investigated. Effect of concentration of the salts and the complexing agents, cathodic current density and operating temperature on Pb content in the electroplate have been studied. Finally, the optimum bath compostion and technological conditions for electroplating bright SnPb alloy with about 10 wt% lead content have been determined.
出处
《电镀与精饰》
CAS
1999年第4期12-14,共3页
Plating & Finishing
关键词
电镀
柠檬酸
铅含量
铅锡合金
镀合金
electroplating, SnPb alloy, citratric acid, lead content
