摘要
分析了当前主流DSP厂商和科研机构的高性能DSP产品的现状及发展趋势。将高性能DSP产品按照体系结构的不同归纳为片上多核、阵列结构、流体系结构等几类,对各类DSP的结构特点与适用领域进行了分析。基于上述分析对未来高性能DSP产品的发展趋势进行了研讨,以供相关产品设计与应用开发人员参考。
State of the art and future trends of the high performance DSPs are discussed for the mainstream vendors and research institutions. High performance DSPs are categorized to 3 types by the architecture： multi-core on chip, array architecture and stream architecture. Architectural characteristics and application domain of the various DSPs are analyzed and based on the preceding analyzation, the future trends of the high performance DSPs are also discussed as the reference for the product designer and application developers.
出处
《中国集成电路》
2011年第4期20-25,共6页
China lntegrated Circuit
基金
863"十一五"重点项目<嵌入式可重构移动媒体处理核心技术>子课题<算法及任务编器研究>(编号2009AA011705)
关键词
DSP
高性能
多核
阵列结构
流体系结构
DSP
high performance
multi-core
array architecture
stream architecture
