期刊文献+

Ni-Cr/Au/瓷连接界面的微观结构与性能

Microstructure and properties of bonding interface of Ni-Cr/Au/porcelain
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摘要 在Ni-Cr合金表面磁控溅射一层Au薄膜作为中间层,采用扫描电镜、能谱、X射线衍射及电子拉伸试验机对Ni-Cr/Au/瓷界面的微观结构与力学性能进行研究。结果表明:Ni-Cr/Au/瓷界面结合致密,无裂纹、孔隙等缺陷,界面反应产物有SnCr_(0.14)O_X和Cr_2O_3。在烤瓷温度T=990℃,烤瓷时间t=2.5 min,Au中间层厚度为1μm时,Ni-Cr/Au/瓷界面的结合强度达51.1 MPa,与Ni-Cr/瓷界面结合强度比较提高了25.2%。 Au film was sputtered on Ni-Cr alloy substrate with magnetron sputtering and it was taken as an interlayer for Ni-Cr/porcelain interface. The microstructures and mechanical properties of Ni-Cr/Au/porcelain interface were investigated by SEM,EDS,XRD and electron tensile testing machine.Experimental results showed that the Ni-Cr/Au/porcelain interface was compact,and there was no crack or flaw at the interfaces. The Ni-Cr/Au/porcelain interface has new phase composition with SnCrO.140X and Cr203.The bonding strength of Ni-Cr/Au/porcelain interface with Au thickness of 1μm is 51.1 MPa at firing temperatures of 990 ℃ for 2.5min,which is improved 25.2% compared with NiCr /porcelain interface.
出处 《焊接》 北大核心 2011年第3期23-26,69,共4页 Welding & Joining
基金 吉林省科技发展基金资助项目(20050511)
关键词 NI-CR合金 Au中间层 陶瓷 微观结构 结合强度 Ni-Cr alloy Au interlayer porcelain microstructure bonding strength
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