抗坏血酸在预阳极化嵌入式超薄碳糊电极上的电化学行为

The electrochemical behavior of ascorbic acid at a preanodized inlaying ultrathin carbon paste electrode

以镍铬合金为基体,直接在其表面嵌入碳糊构建了嵌入式超薄碳糊(IUCP)前驱膜,然后对其表面进行电化学处理,制备了预阳极化嵌入式超薄碳糊电极(PAIUCPE)。扫描电镜表征其形貌,伏安法检验其电化学性能,并以抗坏血酸(AA)为目标物考察PAIUCPE对AA的电化学响应情况,该电极制备非常简单、实验成本极其低廉,可直接用于AA的电化学测量。

An inlaying ultra-thin carbon paste （IUCP） precursor fihn was firstly prepared onto nichrome matrix, and then the IUCP was treated by electrochemical method to structure a pre-anodized inlaying ultra-thin carbon paste electrode （PAIUCPE）. Scanning electron microscope （SEM） and voltammetry were employed to characterize the configuration and electrochemical properties of the electrode. The resulting PAIUCPE exhibited excellent electrochemical response to ascorbic acid （AA）. The peak currents increased linearly with increasing the concentration of AA. The proposed electrode can be applied to the determination of AA.