摘要
主要介绍了微波组件产品的激光密封焊接技术,从镀层种类、镀层厚度、焊接方式和焊接气氛等进行分析,比较了不同镀层厚度、叠焊焊接方式和对焊焊接方式对激光焊接的影响,试验表明,表面镀镍金层较厚时,将对激光焊接质量产生影响。不同的焊接方式对镀层的要求也有差别,采用对焊方式时,盒体镀层厚度应严格控制,而使用叠焊方式时,表面镀层厚度控制范围可以稍宽一些。除激光焊接参数外,激光焊接气氛对激光焊接的影响也较大。
Laser seal welding technology in microwave modules was described.The plating layer type,plating layer thickness,welding manner and welding atmosphere were analyzed.The effects of various plating layer thicknesses,lap welding manner and butt welding manner on the welding quality were compared.The test result shows that the thicker plating layer will affect the welding quality directly.Different welding manners have different requirements for the plating layer,the thickness should be strictly controlled in butt welding,and the thickness can has a bigger scope in lap welding.Besides the parameters,the welding atmosphere has an influence on laser welding.
出处
《半导体技术》
CAS
CSCD
北大核心
2011年第5期406-409,共4页
Semiconductor Technology
关键词
材料
镀层
焊接气氛
封焊方式
激光焊接
material
plating layer
welding atmosphere
welding manner
laser welding
