期刊文献+

废线路板流化床焚烧过程中溴化氢的生成与脱除 被引量:5

Forming and scavenging of hydrogen bromide during combustion of waste printed circuit boards in fluidized bed
下载PDF
导出
摘要 利用热重分析仪和流化床电加热炉实验装置研究了废旧电路板焚烧回收过程中HBr的生成与脱除特性。结果表明:HBr主要在电路板快速失重阶段(290~406℃)析出,与溴化环氧树脂和环氧树脂的主链降解同时发生。添加CaO能有效地脱除焚烧过程产生的HBr,同时不影响电路板的降解行为;通过添加适当比例的CaO以及控制加热速率、流化床温度等焚烧条件可以较好地消除HBr的危害。 The characteristics of HBr forming and scavenging during the combustion of waste printed circuit boards were investigated by using the TG-|FTIR and a fluidized bed system.The results indicated that HBr was mainly released at the fast weight-|losing stage(290 to 406 ℃) of printed circuit boards,accompanying with the main chain scissions of epoxy and brominated epoxy backbones;HBr could be efficiently scavenged by adding calcium oxide,which had no negative effect on the degradation behavior of printed circuit boards;and the harm of HBr could be efficiently eliminated by adding proper calcium oxide as well as by controlling the heating rate and the temperature.
出处 《能源工程》 2011年第2期45-49,共5页 Energy Engineering
基金 国家863计划资助项目(2007AA061301-05)
关键词 废线路板 流化床 焚烧 氧化钙 溴化氢 waste printed circuit boards fluidized bed combustion calcium oxide hydrogen bromide
  • 相关文献

参考文献14

  • 1彭绍洪,陈烈强,蔡明招.废旧电路板热解过程中溴化氢的生成及脱除[J].华南理工大学学报(自然科学版),2006,34(10):15-19. 被引量:22
  • 2陈烈强,谢明权.废印刷电路板回收处理技术的研究进展[J].广东化工,2008,35(9):100-103. 被引量:14
  • 3BLAZSO M,CZEHENY Z,CSOMA C.Pyrolysis and debromination of flame retarded polymers of electronic scrap studied by analytical pyrolysis[J].J Anal Appl Pyrolysis,2002(64):249-261.
  • 4郭小汾,杨雪莲,李海滨,陈勇,李凡,谢克昌.钙化合物的种类对脱氯特性的影响[J].环境科学学报,2000,20(6):776-780. 被引量:21
  • 5LUDA M P,GAMINO G,BALABANOVICH A.Scavenging of halogen in recycling of halogen-based polymermaterials[J].Macrol Symp,2002,180(1):141-152.
  • 6SAKAI S,WATANABE J,HONDA Y,et al.Combustion of brominated flame retardants and behavior of its byproducts[J].Chemosphere,20O1,42:519-531.
  • 7LAI Y C,LEE W J,LI H W.Inhibition of polybrominated dibenzo-p-dioxin and dibenznfuran formation from the pyrolysis of printed circuit boards[J].Environ.Sci.Technol.,2007,41:957-962.
  • 8BARIN I.Thermochemical data of pure substances[M].WILEY-VCH Verlag GmbH,D-69469 Weinheim,2003.
  • 9BARONTINI F,COZZANI V.Formation of hydrogen bromide and organobrominaled compounds in the thermal degradation of electronic boards[J].Anal Appl Pyrolysis,2006,77:41-55.
  • 10沈志刚,蔡楚江,邢玉山,麻树林.废印刷电路板中非金属材料的回收与利用[J].化学工程,2006,34(10):59-62. 被引量:28

二级参考文献67

共引文献118

同被引文献41

  • 1徐渠,陈东辉,陈亮,黄满红.碘化法从废弃印刷线路板中浸取金[J].有色金属,2010,62(3):88-90. 被引量:12
  • 2慎义勇.我国废旧线路板处置现状及非金属材料利用设想[J].中国环保产业,2006(6):34-36. 被引量:12
  • 3潘君齐,刘志峰,张洪潮,刘光复.超临界流体废弃线路板回收工艺[J].合肥工业大学学报(自然科学版),2007,30(10):1287-1291. 被引量:10
  • 4李飞,赵增立,李海滨,陈勇,吴逸民.废弃印刷线路板熔融盐气化特性研究[J].环境科学学报,2007,27(11):1851-1857. 被引量:11
  • 5Deepak Pant,Deepika Joshi, Manoj K Upreti,et al.Chemical and biological extraction of metals present in E waste: A hybrid technology [J].Waste Management,2012,32: 979- 990.
  • 6L H Yamane,V T Moraes,D C R Espinosa,et aI.Recycling of WEEE: Characterization of spent printed circuit beards from mobile phones and computers [J].Waste Management, 2011,31:2 553-2 558.
  • 7I Birloaga,I D Michelis,F Ferella,et aI.Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery[J].Waste Management, 2013,33:935-941.
  • 8Yokoyamas,ljim.Recycling of printed wiring board waste in: Proceedings of 1993 IEEE/Tsukuba, International Work Shop on Advanced Robotics I EEE, 1993,55-58.
  • 9L Flandinet,F Tedjar,V Ghetta,et aI.Metals recovering from waste printed circuit boards (WPCBs) using molten salts [J].Journal of Hazardous Materials,2012,213-214:485- 490.
  • 10Li J Y,Xu X L,Liu W Q.Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones[J]. Waste Management,2012,32:1 209-1 212.

引证文献5

二级引证文献20

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部