Ag/Cu共渗不锈钢表面的微观结构及抗菌性能研究

Microstructure and Antibacterial Properties of AISI304 Stainless Steel Doped by Ag/Cu

以银铜合金为靶材,利用辉光等离子体在AISI304不锈钢表面同时渗入银和铜,制备性能优良的抗菌不锈钢。对渗层的形貌、化学组成、耐蚀性能和抗菌性能进行了研究,结果表明,所得渗层在不锈钢表面分布均匀,Ag/Cu元素质量比为4.9∶3;不锈钢表面渗层腐蚀电位由-0.103V提高到0.07V,自腐蚀电流密度从1.66×10-7A/cm2降至5.813×10-9A/cm2,耐腐蚀性能有所提高;渗层对大肠杆菌和金黄色葡萄球菌的杀菌率均达100%。

AISI304 stainless steel doped by silver and copper ions simultaneously with glow discharge plasma metallurgy was prepared. The antibacterial properties of Ag/Cu doped stainless steel were estimated by standard plate count method. The doped layer was characterized by energy dispersive X-ray spectrometry（EDS）. The corrosion resistance of Ag/Cu doped stainless steel was evaluated by electrochemical polarization curve in 3.5wt% NaC1 solution. The results show that the weight ratio of silver and copper ions existed in the doped layer of stainless steel is 4. 9 ： 3. The corrosion potential of the layer increase from -0. 103V to 0. 07V. The corrosion current densities decrease from 1.66×10^-7A/cm^2 to 5.813×10^-9A/cm^2. The corrosion resistance of stainless steel is enhanced after doped with copper and silver ions. Excellent antibacterial activities （100%） against both Gram-negative Escherichia coli and Grampositive Staphylococcus aureus are obtained for Ag/Cu doped stainless steel.