积层(Build-up)封装工艺的发展及其设计挑战(1)

Build-up packaging process development and design challenge

回顾了自1988年以来的逐次积层(SBU)层压基板的发展过程。文中报告了IBM自2000年采用的这种工艺的开发过程。这些层压基板是一种非均匀性结构,有3部分组成:芯板,积层和表面层,每一部分都是为满足封装应用的需求而开发。薄膜工艺极大提高了SBU层压基板的绕线能力,同时也使得这种工艺非常适合高性能设计。本文着重阐述了IBM在将该工艺用于ASIC和微处理器封装时,在设计、制造和可靠性测试等各个阶段所遇到的挑战。

This paper reviews sequential build-up（SBU） laminate substrate development from its beginning in 1988.It reports on developments in this technology for IBM applications since its adoption in 2000.These laminated substrates are nonuniform structures composed of three elements： a core,build-up layers,and finishing layers.Each element has evolved to meet the demands of packaging applications.Thin-film processing has greatly enhanced the wiring capability of SBU laminate substrates and has made this technology very suitable for high-performance designs.This paper focuses on the challenges encountered by IBM during the design,manufacture,and reliability testing phases of development of SBU substrates as solutions for application-specific integrated circuit（ASIC） and microprocessor packaging applications.