亚铁氰化钾添加于次亚磷酸钠还原化学镀铜的试验优化

Optimizing tests in Electroless copper plating using Sodium Hypophosphite as reducing agent append K_4Fe(CN)_6

化学镀铜技术是印制电路中的重要部分,采用正交实验法研究了以次亚磷酸钠为还原剂添加亚鉄氰化钾的化学镀铜溶液,得到了的最佳参数和条件。镀液中添加亚铁氰化钾可以显著降低沉积速度,使镀层变得均匀致密,形貌得到改善,电阻率明显降低,镀层中镍的含量也有所降低。

Electroless copper plating is the important part of the printed circuit board.In this paper,the electroless copper plating using sodium hypophosphite as reducing agent appended K4Fe（CN）6 with optimizing tests,and the best parameter and condition were reviewed.The deposition rate was decreased significantly with the addition of K4Fe（CN）6 to the plating solution,the plating became compact and uniform,and the morphology of the plating was improved.Both of the resistivity of the copper deposits and the contents of nickel in the plating were decreased.