表面安装漏版设计要求

Requirements for SMT stencil design

焊膏印刷是表面安装工艺的一个关键环节,而漏版的设计水平和制作技术将直接影响到印刷的质量。本文将着重关注漏版的设计要求,阐述漏版的网框、厚度、基准点等的通用要求,并针对各种不同的元器件封装形式和用途,对漏版开口形状和尺寸要求做了详细的说明。

Solder printing is the key factor of SMT process,therefore,the design capability and manufacturing technology of stencil will influence the quality of printing directly.In this article,the requirements for stencil design will be paid more attention,and general requirements for size and material of frame,thickness of stencil,shape of fiducial and so on are also introduced.According to different usage and package,the requirements for size and shape of stencil are interpreted in detail.